On the Influence of Mass Component Distribution over Plates for the Structural Design of On-Board Electronic Devices
Renato Grangeiro Buzzoleti1; Agenor de Toledo Fleury1
1 Centro Universitário da FEI
doi:10.20906/CPS/COB-2015-1807
Resumo
Each on board electronic equipment shall be subject to vibration during its life. It is expected that equipment undergoes some vibrations at least during transportation, if not during its operational life. As vibration is the second biggest source for electronic equipment fails (around 20%), it is quite important to understand how better protect the on board electronics, mainly if it is under high acceleration levels as in satellite applications. For different reasons as accessibility, handling and maintenance, on board electronics usually consists of modules (boxes or casings) which receive the printed circuit board where electronic components are mounted. Printed circuit boards are responsible for supplying mechanical support to the electronic devices and, at the same time, assure electrical connectivity to the circuit. The aim of this work is to study how the arrangements of the components in a plate should affect its dynamic behavior and how this distribution may be used for structural design safety. For doing this, a finite element model is proposed and natural frequencies and mode shapes are analyzed. Six different types of masses distribution have been considered. In order to evaluate mass influence on plate dynamic behavior, for each arrangement component masses was increased in three steps. The same has been done with the area of the mounting support. After numerical analysis, experimental tests have been performed and their results were compared to the FEM models and to other results from the literature.
Palavras-chave: Structural Dynamics; Plate Vibrations; Electronic Devices; Mass Distribution; Experimental Results