Debonding of adhesive joints: existing and emerging technologies
M. D. Banea1; L. F. M. da Silva2; R. J. C Carbas2; R.D.S.G. Campilho3
1 CEFET/RJ, Federal Center of Technological Education in Rio de Janeiro, Brazil; 2 Departamento de Engenharia Mecânica, Faculdade de Engenharia, Universidade do Porto; 3 Departamento de Engenharia Mecânica, Instituto Superior de Engenharia do Porto, Politécnico do Porto
doi:10.20906/CPS/COB-2015-1746
Resumo
Adhesive bonding has found applications in various areas from high technology industries such as aeronautics, aerospace, electronics, and automotive to traditional industries such as construction, sports and packaging. Adhesives can be used to join metals, polymers, ceramics, cork, rubber, and combinations of any of these materials. Moreover, nowadays, new products consist more and more of a combination of special new materials, which needs to be joined according to their specific characteristics. These materials (i.e. ceramics, carbon fibre reinforced polymers (CFRP), etc.) are usually expensive which create an increasing demand for recyclability, driven by economic as well as environmental reasons. Thus, the development of new technologies and processes for easy recycle and repair of bonded structures are becoming of great interest for the industry. If bonds can be broken without damage of the components, recycling is easier. Also for an environmental friendly disassembly of bonded structures, it is necessary to separate the joint between the bonded components so that the different materials can be reused on a qualitatively high level. In this paper, an overview of the existing technologies of debonding adhesive joints is presented. Further, an innovative technique for adhesives debonding by combining the inductive heating method and the use of Thermally Expandable Particles (TEPs) is described.
Palavras-chave: Debonding of adhesive joints; Thermally expandable particles (TEPs)